COMSOL 3.3a update 发布

nanoscale

comsol发布了3.3版本的更新3.3a

下面是简单的更新说明

不需要更新license，运行更新的exe文件即可，

Material Library
Being able to create a simulation that mirrors reality depends not onlyon accurate geometries and physics but also the specification ofreal-world materials. The Material Library automates the process foraccessing material data while still offering flexibility.

Based on the Material Property Database (MPDB) from JAHM Software,Inc., the Material Library contains information for materials such asminerals, rocks, soil, metal alloys, oxides, steels, thermalinsulators, semiconductors, and optical materials. It includes:

    * 2500 materials and 20,000 property functions, each described as apiecewise polynomial of some variable, typically temperature.
    * A search feature that lets you look for materials by name, UNS number, or DIN number
    * Product information


New Features
COMSOL Multiphysics

    * Support for Microsoft's Vista operating system
    * Support for Macs with Intel processors
    * User interface in Spanish
    * A function type, Piecewise Analytic Functions, particularly useful in the new Material Library
    * Implementation of unit consistency, and the highlighting of unexpected units
    * Operators for GUI access of all solutions in a time-dependent,parametric, or eigenvalue problem, or at any (interpolated) time fortime-dependent problems
    * Easier use of the geometric multigrid solver for 3D fluid flow
    * Additional visualization, and improved solver features
    * Updated models
    * New model:
          o Joule Heating in a MEMS Device


AC/DC Module

    * Increased usability of assemblies in electromagnetics problems
    * Automatic gauge fixing with scaling
    * Floating potential and port boundary conditions on pair boundaries
    * Improved solver defaults


Acoustics Module

    * Faster far-field postprocessing abilities, able to be evaluated everywhere
    * Improved implementation of PMLs (perfectly matched layers)
    * New boundary conditions on pairs—pressure acoustics, aeroacoustics—including conditions for simulating perforated plates
    * Point and line sources for transient analysis in pressure acoustics
    * New vortex sheet boundary condition for aeroacoustics
    * Support for the solving of large acoustics problems using multigrid techniques
    * Updated models
    * New models:
          o Jet Pipe
          o Muffler with Perforates


CAD Import Module

    * Improved automatic CAD repair
    * Interactive CAD repair and defeaturing
    * New CAD Import Module command-line functions
    * Faster rendering of geometries using the Parasolid® engine


Chemical Engineering Module

    * Introduction of the k-ω turbulence model
    * Improved k-ε turbulence model
    * Improved boundary conditions for turbulent flow
    * Implementation of realizability constraints
    * Predefined modeling interface (application modes) for level set functions
    * Two-phase flow modeling interface using level sets, includingspecial boundary conditions for wetted walls (wall adhesion) andinitial fluid interface
    * Rigid body motion modeling example
    * Updated models
    * New models:
          o Diesel Particulate Filter
          o Bending Pipe


Heat Transfer Module

    * Introduction of the k-ω turbulence model for modeling turbulent heat transfer
    * Improved k-ε turbulence model
    * Improved boundary conditions for turbulent flow
    * Implementation of realizability constraints
    * Thin thermally resistive layer modeling interface
    * Updated models
    * New models:
          o A Shell-and-Tube Heat Exchanger


MEMS Module

    * Predefined modeling interface (application modes) for level set functions
    * Two-phase flow modeling interface using level sets, includingspecial boundary conditions for wetted walls (wall adhesion) andinitial fluid interface
    * Axisymmetric contact
    * Improvements in general contact performance
    * Improved implementation of PMLs (perfectly matched layers) for elastic waves
    * Improvements in solving film damping applications
    * Improved solver settings for 3D microfluidics models
    * Updated models
    * New models:
          o Capillary Filling
          o Thermal Expansion


RF Module

    * Exports in the Touchstone file format
    * Divergence condition with automatic scaling
    * More general port boundary condition with support for assemblies and multiple input ports
    * Improved solver defaults
    * Updated model
    * New model:
          o Coaxial to Waveguide Coupling


Structural Mechanics Module

    * Implementation of axisymmetric contact
    * Improvements in general contact performance
    * Improved implementation of PMLs (perfectly matched layers)
    * Updated model
    * New model:
          o Thermal Expansion


COMSOL Reaction Engineering Lab™

    * Import of kinetics, thermodynamics, and transport properties from CHEMKIN® file formats
    * Automatic initialization of slave species to provide stability in equilibrium reactions
    * Updated models
    * New models:
          o Compression Ignition of Methane
          o CSTR Startup

zhangmeng

Comsol3.2就不需要Matlab的支持了，不过很不稳定
程序很大，但好像有用的不多，很多都要自己开发
3.3听说稳定了，我拿到了试用版
又变大了，启动一次就得几分钟
我用他算了个渗流问题，速度超慢

chbo76

现在3.4都出了，据说支持64位的计算。
大家的福音啊。